Okwu mmalite: Ihe ịma aka nka nka na igwe eletrọnịkị ụgbọ ala naIhe ọhụrụ nke Capel

Dị ka ịnya ụgbọ ala kwụụrụ onwe ya na-amalite na L5 na ụgbọ ala eletrik (EV) sistemu njikwa batrị (BMS) na-achọ njupụta ike na nchekwa dị elu, teknụzụ PCB ọdịnala na-agbasi mbọ ike idozi nsogbu ndị dị oke egwu:

• Ihe ize ndụ ndị na-agba ọsọ na-ekpo ọkụ: ECU chipsets gafere oriri ike 80W, yana okpomọkụ mpaghara na-erute 150°C
• Oke njikọta 3D: BMS chọrọ 256+ ọwa mgbaàmà n'ime 0.6mm ọkpụrụkpụ osisi
• Ọdịda mmaji: Sensọ kwụụrụ onwe ya ga-anagide mkpagharị igwe 20G
• Achọrọ miniaturization: Ndị na-ahụ maka LiDAR chọrọ obosara nchọta 0.03mm na nchịkọta 32-layer

Teknụzụ Capel, na-eji afọ 15 nke R&D eme ihe, na-ewebata ngwakọta ngwọta mgbanwePCB dị elu thermal conductivity(2.0W/mK),PCB ndị na-eguzogide okpomọkụ(-55°C ~ 260°C), na32-oyi akwaHDI lie / kpuru site na teknụzụ(microvia 0.075mm).

Nkeji 1: Mgbanwe njikwa okpomọkụ maka ECU ịnya ụgbọ ala kwụụrụ onwe ya

1.1 Ihe ịma aka ọkụ ECU

• Njupụta okpomọkụ nke Nvidia Orin chipset: 120W/cm²
• Mpempe akwụkwọ FR-4 (0.3W/mK) na-eme ka mgbawa mgbawa 35% gafere
• 62% nke ọdịda ECU sitere na ike ọgwụgwụ na-akpata nrụgide okpomọkụ

1.2 Teknụzụ nkwalite okpomọkụ nke Capel

Ihe ohuru ohuru:

• Nano-alumina kwadoro ihe mgbochi polyimide (2.0 ± 0.2W/mK)
• 3D ọla kọpa arrays (400% mụbara okpomọkụ dissipation mpaghara)

Ọganihu usoro:

• Laser Direct Structuring (LDS) maka ụzọ ọkụ kachasị mma
• Ngwakọta ngwakọ: 0.15mm ọla kọpa dị oke mkpa + 2oz akwa ọla kọpa dị arọ

Ntụnyere arụmọrụ:

Nkeji 2: Mgbanwe Wiring BMS nwere teknụzụ HDI 32-Layer

2.1 Ihe mgbu ụlọ ọrụ na imewe BMS

• 800V nyiwe chọrọ 256+ cell voltaji nlekota ọwa
• Nhazi omenala gafere oke ohere site na 200% yana enweghị ndakọrịta 15% impedance

2.2 Ngwọta njikọta ọnụ dị elu nke Capel

Injinia Stackup:

• 1+N+1 Ọdịdị HDI ọ bụla (okpukpu 32 na ọkpụrụkpụ 0.035mm)
• ± 5% njikwa impedance dị iche (10Gbps akara ọsọ ọsọ)

Teknụzụ Microvia:

• 0.075mm laser-ìsì vias (12: 1 akụkụ ruru)
• <5% na-etinye ego efu (IPC-6012B Klas 3 kwadoro)

Nsonaazụ Benchmark:

Nkeji 3: ntụkwasị obi dị oke egwu gburugburu - MIL-SPEC Ngwọta akwadoro

3.1 Arụmọrụ ihe dị oke ọkụ

• Okpomọkụ Ntugharị Glass (Tg): 280°C (IPC-TM-650 2.4.24C)
• Okpomọkụ ire ere (Td): 385°C (5% arọ ọnwụ)
• Ịlanahụ Ụjọ Igwe ọkụ: 1,000 okirikiri (-55°C↔260°C)

3.2 Teknụzụ Nchekwa Onwe Onye

• Ihe mkpuchi polymer anyadokwa Plasma (1,000h nnu na-eguzogide ọgwụ)
• 3D EMI oghere oghere (60dB attenuation @10GHz)

Nkeji 4: Ọmụmụ ihe - Mmekọrịta na Global Top 3 EV OEM

4.1 800V BMS njikwa modul

• Ihe ịma aka: Jikọta 512-ọwa AFE na oghere 85 × 60mm
• Ngwọta:
  1. PCB 20-Layer rigid-flex (radius gbagọọ 3mm)
  2. Netwọk ihe mmetụta okpomọkụ agbakwunyere (obosara trace 0.03mm)
  3. Igwe nju oyi nke igwe-isi mpaghara (0.15°C·cm²/W nguzogide okpomọkụ)

4.2 L4 Onye njikwa ngalaba kwụụrụ onwe ya

• Nsonaazụ:
  • Mbelata ike 40% (72W → 43W)
  • 66% nha mbelata vs. omenala aghụghọ
  • Asambodo nchekwa ọrụ ASIL-D

Nkeji 5: Asambodo na Nkwenye Ogo

Sistemu ogo Capel karịrị ụkpụrụ ụgbọ ala:

• Asambodo MIL-SPEC: Dabara na GJB 9001C-2017
• Nkwekọrịta ụgbọ ala: IATF 16949: 2016 + AEC-Q200 nkwado
• Nnwale ntụkwasị obi:
  • 1,000h HAST (130°C/85% RH)
  • 50G igwe ujo (MIL-STD-883H)

Mmechi: Osote-Gen PCB Technology Roadmap

Capel na-asụ ụzọ:

• Ngwa ngwa ngwa agbakwunyere (nchekwa oghere 30%)
• Optoelectronic ngwakọ PCB (0.2dB/cm ọnwụ @850nm)
• Sistemụ DFM na-edu AI (mmalite mkpụrụ 15%)

Kpọtụrụ ndị otu injinia anyịtaa iji kwalite ihe ngwọta PCB ahaziri maka ngwa eletrọnịkị ụgbọ ala ọzọ.