CAPEL FPC & Flex-Ripid PCB Mmepụta Ike
Ngwaahịa | Njupụta dị elu | |||
Njikọ njikọ (HDI) | ||||
Ọkọlọtọ Flex sekit Flex | Sekit na-agbanwe agbanwe | Sekit Flex siri ike | Mgbanwe nke Membrane | |
Ọkọlọtọ Panel Nha | 250mm x 400mm | Mpịakọta fomat | 250mmX400mm | 250mmX400mm |
obosara ahịrị na oghere | 0.035mm 0.035mm | 0.010"(0.24mm) | 0.003" (0.076mm) | 0.10"(.254mm) |
Ọkpụkpụ ọla kọpa | 9um / 12um / 18um / 35um / 70um / 100um / 140um | 0.028mm-.01mm | 1/2 oz. na elu | 0.005"-.0010" |
Ọnụọgụ oyi akwa | 1-32 | 1-2 | 2-32 | 1-2 |
VIA / DRILL SIZE | ||||
Dayameta oghere kacha nta (Mechanical). | 0.0004" ( 0.1 mm ) 0.006" ( 0.15 mm ) | N/A | 0.006" (0.15 mm) | 10 mil (0.25 mm) |
Opekempe Site ( Laser ) nha | 4 mil (0.1mm) 1 mil (0.025 mm) | N/A | 6 mil (0.15 mm) | N/A |
Opekempe Micro Via ( Laser ) nha | 3 mil (0.076 mm) 1 mil (0.025 mm) | N/A | 3 mil (0.076 mm) | N/A |
Ihe stiffener | Polyimide / FR4 / Metal / SUS / Alu | PET | FR-4 / Poyimide | PET / Ọla / FR-4 |
Ihe nchekwa | Ọla kọpa / ọlaọcha Lnk / Tatsuta / Carbon | Silver Foil/Tatsuta | Ọla kọpa / Silver Ink / Tatduta / Carbon | Ọlaọcha foil |
Ihe eji eme ihe | 2 mil (0.051 mm) 2 mil (0.051 mm) | 10 mil (0.25mm) | 2 nde (0.51 mm) | 5 mil (0.13 mm) |
Zif ndidi | 2 mil (.051 mm) 1 mil (0.025 mm) | 10 mil (0.25mm) | 2 nde (0.51 mm) | 5 mil (0.13 mm) |
Nkpuchi ihe nkpuchi | ||||
Solder Mask Bridge n'etiti Dam | 5 mil (.013 mm) 4 mil (0.01mm) | N/A | 5 mil (0.13 mm) | 10 mil (0.25mm) |
Nlekere ndebanye aha ihe nkpuchi solder | 4 mil (.010 mm) 4 mil (0.01mm) | N/A | 5 mil (0.13 mm) | 5 mil (0.13 mm) |
Mkpuchi | ||||
Ndebanye aha mkpuchi | 8 nde 5 nde | 10 nde | 8 nde | 10 nde |
Ndebanye aha PIC | 7 nde 4 nde | N/A | 7 nde | N/A |
Ndebanye aha nkpuchi solder | 5 nde 4 nde | N/A | 5 nde | 5 nde |
Emecha elu elu | ENIG/Ọlaọcha imikpu/Mbamimi Tin/Gold Plating/Tin Plating/OSP/ ENEPIG | |||
Akụkọ mgbe ochie | ||||
Ogologo kacha nta | 35 nde 25 nde | 35 nde | 35 nde | Ihe mkpuchi eserese |
Obere obosara | 8 nde 6 nde | 8 nde | 8 nde | |
Oghere kacha nta | 8 nde 6 nde | 8 nde | 8 nde | |
Ndebanye aha | ±5mil ±5mil | ± 5mil | ± 5mil | |
Mgbochi | ± 10% ± 10% | ± 20% | ± 10% | NA |
SRD (iwu igwe anwụ anwụ) | ||||
Nlekwa anya nkọwapụta | 5 mil (0.13 mm) 2 mil (0.051 mm) | N/A | 5 mil (0.13 mm) | 5 mil (0.13 mm) |
Obere radius | 5 mil (0.13 mm) 4 mil (0.10 mm) | N/A | 5 mil (0.13 mm) | 5 mil (0.13 mm) |
N'ime Radius | 20 mil (0.51 mm) 10 mil (0.25 mm) | N/A | 31 nde | 20 mil (0.51 mm) |
Punch nha oghere kacha nta | 40 mil (10.2 mm) 31.5 mil (0.80 mm) | N/A | N/A | 40 mil (1.02 mm) |
Nkwenye nke Punch Hole Size | ± 2mil (0.051 mm) 1 nde | N/A | N/A | ± 2 nde (0.051 mm) |
Obosara oghere | 20 mil (0.51 mm) 15 mil (0.38 mm) | N/A | 31 nde | 20 mil (0.51 mm) |
Ndidi nke oghere ka ịkọwapụta | ± 3 nde ± 2 nde | N/A | ± 4 nde | 10 nde |
Nkwenye nke ọnụ ọnụ oghere ka nkọwapụta | ± 4 nde ± 3 nde | N/A | ± 5 nde | 10 nde |
Opekempe Trace iji depụta | 8 nde 5 nde | N/A | 10 nde | 10 nde |
Ike mmepụta CAPEL PCB
Nka nka | ||
Mba. | Ihe oru ngo | Ngosipụta teknụzụ |
1 | oyi akwa | 1 - 60 (oyi akwa) |
2 | Mpaghara nhazi kachasị | 545 x 622 mm |
3 | Obere nkụchi | 4 (oyi akwa) 0.40mm |
6 (oyi akwa) 0.60mm | ||
8 (oyi akwa) 0.8mm | ||
10 (oyi akwa) 1.0mm | ||
4 | Obosara ahịrị kacha nta | 0.0762 mm |
5 | Opekepe kacha | 0.0762 mm |
6 | Oghere igwe kacha nta | 0.15mm |
7 | Oghere mgbidi ọla kọpa ọkpụrụkpụ | 0.015 mm |
8 | Nkwenye oghere metallized | ± 0.05mm |
9 | Nkwekọrịta oghere na-abụghị metalized | ± 0.025mm |
10 | Nkwenye oghere | ± 0.05mm |
11 | Nkwenye akụkụ | ± 0.076mm |
12 | Akwa akwa mmiri kacha nta | 0.08mm |
13 | Nguzogide mkpuchi | 1E+12Ω (nkịtị) |
14 | Oke ọkpụrụkpụ nke efere | 1:10 |
15 | Thermal ujo | 288 ℃ (4 ugboro na 10 sekọnd) |
16 | Agbagọ ma gbagọ | ≤0.7% |
17 | Ike mgbochi ọkụ | 1.3KV / mm |
18 | Ike mgbochi iwepụ | 1.4N/mm |
19 | Solder na-eguzogide ike | ≥6H |
20 | Ịkwụsị ire ọkụ | 94V-0 |
21 | Njikwa mgbochi | ±5% |
Ike mmepụta CAPEL PCBA
Otu | Nkọwa | |
Etiti oge | 24 hour Prototyping, nnyefe oge nke obere-ogbe bụ banyere 5 ụbọchị. | |
PCBA ike | SMT patch 2 nde isi / ụbọchị, THT 300,000 isi / ụbọchị, iwu 30-80 / ụbọchị. | |
Ngwa akụrụngwa | Turnkey | Na tozuru okè na irè akụrụngwa procurement management usoro, anyị na-eje ozi PCBA oru ngo na elu-eri arụmọrụ. Otu ndị injinia na-azụ ahịa ọkachamara na ndị ọrụ ịzụ ahịa nwere ahụmahụ bụ maka ịzụrụ na njikwa nke akụrụngwa maka ndị ahịa anyị. |
Ekebere ma ọ bụ ebufe ya | Site na otu ndị na-ahụ maka ịzụ ahịa siri ike na ngwongwo akụrụngwa, ndị ahịa na-enye anyị akụrụngwa, anyị na-arụ ọrụ mgbakọ. | |
Ngwakọta | Nabata akụrụngwa ma ọ bụ ihe pụrụ iche na-enye ndị ahịa. yana components resourcing maka ndị ahịa. | |
PCBA Solder Ụdị | SMT, THT, ma ọ bụ PCBA soldering ọrụ abụọ. | |
Solder Tapawa/Tin Waya/Tin Bar | ndu na-enweghị ndu (RoHS compliant) PCBA nhazi ọrụ. Ma nyekwa ya tapawa solder ahaziri. | |
Stensụl | laser ọnwụ stencil iji hụ na ihe ndị dị ka obere-pitch ICs na BGA izute IPC-2 Class ma ọ bụ karịa. | |
MOQ | 1 ibe, mana anyị na-adụ ndị ahịa anyị ọdụ ka ha mepụta ma ọ dịkarịa ala 5 sample maka nyocha na nyocha nke onwe ha. | |
Ogo akụrụngwa | • Ihe ndị na-agafe agafe: anyị dị mma na ịkwado inch 01005 (0.4mm * 0.2mm), 0201 obere ihe ndị dị otú ahụ. | |
• IC ndị dị elu dị ka BGA: Anyị nwere ike ịchọpụta ihe ndị BGA nwere oghere min 0.25mm site na X-ray. | ||
Ngwungwu akụrụngwa | reel, teepu ịkpụ, tubing, na pallets maka ihe SMT. | |
Oke kacha zie ezi nke akụrụngwa (100FP) | Nke ziri ezi bụ 0.0375mm. | |
Ụdị PCB nwere ike ime | PCB (FR-4, metal mkpụrụ), FPC, PCB siri ike-flex, Aluminom PCB, HDI PCB. | |
oyi akwa | 1 - 30 (okpukpu) | |
Mpaghara nhazi kachasị | 545 x 622 mm | |
Obere nkụchi | 4 (oyi akwa) 0.40mm | |
6 (oyi akwa) 0.60mm | ||
8 (oyi akwa) 0.8mm | ||
10 (oyi akwa) 1.0mm | ||
Obosara ahịrị kacha nta | 0.0762 mm | |
Opekepe kacha | 0.0762 mm | |
Oghere igwe kacha nta | 0.15mm | |
Oghere mgbidi ọla kọpa ọkpụrụkpụ | 0.015 mm | |
Nkwenye oghere metallized | ± 0.05mm | |
Oghere enweghị metalized | ± 0.025mm | |
Nkwenye oghere | ± 0.05mm | |
Nkwenye akụkụ | ± 0.076mm | |
Akwa akwa mmiri kacha nta | 0.08mm | |
Nguzogide mkpuchi | 1E+12Ω (nkịtị) | |
Oke ọkpụrụkpụ nke efere | 1:10 | |
Thermal ujo | 288 ℃ (4 ugboro na 10 sekọnd) | |
Agbagọ ma gbagọ | ≤0.7% | |
Ike mgbochi ọkụ | 1.3KV / mm | |
Ike mgbochi iwepụ | 1.4N/mm | |
Solder na-eguzogide ike | ≥6H | |
Ịkwụsị ire ọkụ | 94V-0 | |
Njikwa mgbochi | ±5% | |
Ụdị faịlụ | BOM , PCB Gerber, Họrọ na ebe. | |
Nnwale | Tupu nnyefe, anyị ga-etinye ụdị ule dị iche iche na PCBA na ugwu ma ọ bụ na-amarị elu: | |
• IQC: nyocha na-abata; | ||
• IPQC: nyocha n'ime mmepụta, ule LCR maka mpempe mbụ; | ||
• QC a na-ahụ anya: nlele mma oge niile; | ||
• AOI: mmetụta soldering nke patch components, obere akụkụ ma ọ bụ polarity nke components; | ||
• X-Ray: lelee BGA, QFN na ihe ndị ọzọ dị elu bụ ihe PAD zoro ezo; | ||
• Nnwale na-arụ ọrụ: Nnwale ọrụ na ịrụ ọrụ dịka usoro nyocha nke ndị ahịa si dị na usoro iji hụ na nnabata. | ||
Mmezi & rụgharịa ọrụ | Ọrụ Ndozi BGA anyị nwere ike wepu BGA na-ezighi ezi, anọghị ya na ụgha wee tinyeghachi ha na PCB nke ọma. |